Simulation-based investigation of microwave treatments for printed circuit boards
exemplified by coating cures
Bui, Trinh Dung
1981-
aut
text
theses
Text
Hochschulschrift
gw
2014
monographic
XA-DE
2014
eng
text/html
application/pdf
Online-Ressource Ill., graph. Darst.
Coatings are usually used to protect printed circuit boards (PCB) from harsh environment. It is difficult to cure thick coatings from exterior to interior as the heat curing. In this case, curing by the means of microwave irradiation can be taken into account. With the participation of metallic structures, there will be some challenges such as inhomogeneous field distributions or high risk of high field strengths. So with the help of numerical simulations, this study is carried out for finding how PCB structures react with the microwave radiation to support homogeneous coating cures.
vorgelegt von Trinh Dung Bui
Rostock, Univ., Fak. für Informatik und Elektrotechnik, Diss., 2014
621.381531
621.3
ZN 4120
53.53
52.78
http://rosdok.uni-rostock.de/resolve?urn=urn:nbn:de:gbv:28-diss2014-0194-8
http://rosdok.uni-rostock.de/resolve?urn=urn:nbn:de:gbv:28-diss2014-0194-8&pdf
http://nbn-resolving.de/urn:nbn:de:gbv:28-diss2014-0194-8
Simulation-based investigation of microwave treatments for printed circuit boards
2014
Druck-Ausgabe
(DE-627)804988676
Bui, Trinh Dung, 1981 -
urn:nbn:de:gbv:28-diss2014-0194-8
935771564
rakwb
DE-627
141209
812371984
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