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<oai_dc:dc xmlns:oai_dc="http://www.openarchives.org/OAI/2.0/oai_dc/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/oai_dc/ http://www.openarchives.org/OAI/2.0/oai_dc.xsd">
  <dc:title xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:srw_dc="info:srw/schema/1/dc-schema">Simulation-based investigation of microwave treatments for printed circuit boards: exemplified by coating cures</dc:title>
  <dc:contributor xmlns:dc="http://purl.org/dc/elements/1.1/">Bui, Trinh Dung , 1981-</dc:contributor>
  <dc:type xmlns:dc="http://purl.org/dc/elements/1.1/">Text</dc:type>
  <dc:type xmlns:dc="http://purl.org/dc/elements/1.1/">theses</dc:type>
  <dc:type xmlns:dc="http://purl.org/dc/elements/1.1/">Text</dc:type>
  <dc:type xmlns:dc="http://purl.org/dc/elements/1.1/">Hochschulschrift</dc:type>
  <dc:date xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:srw_dc="info:srw/schema/1/dc-schema">2014</dc:date>
  <dc:date xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:srw_dc="info:srw/schema/1/dc-schema">2014</dc:date>
  <dc:language xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:srw_dc="info:srw/schema/1/dc-schema">eng</dc:language>
  <dc:format xmlns:dc="http://purl.org/dc/elements/1.1/">electronic resource</dc:format><dc:format xmlns:dc="http://purl.org/dc/elements/1.1/">remote</dc:format><dc:format xmlns:dc="http://purl.org/dc/elements/1.1/">Computermedien</dc:format><dc:format xmlns:dc="http://purl.org/dc/elements/1.1/">Online-Ressource</dc:format><dc:format xmlns:dc="http://purl.org/dc/elements/1.1/">text/html</dc:format><dc:format xmlns:dc="http://purl.org/dc/elements/1.1/">application/pdf</dc:format><dc:format xmlns:dc="http://purl.org/dc/elements/1.1/">Online-Ressource Ill., graph. Darst.</dc:format>
  <dc:description xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:srw_dc="info:srw/schema/1/dc-schema">Coatings are usually used to protect printed circuit boards (PCB) from harsh environment. It is difficult to cure thick coatings from exterior to interior as the heat curing. In this case, curing by the means of microwave irradiation can be taken into account. With the participation of metallic structures, there will be some challenges such as inhomogeneous field distributions or high risk of high field strengths. So with the help of numerical simulations, this study is carried out for finding how PCB structures react with the microwave radiation to support homogeneous coating cures.</dc:description>
  <dc:description xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:srw_dc="info:srw/schema/1/dc-schema">vorgelegt von Trinh Dung Bui</dc:description>
  <dc:description xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:srw_dc="info:srw/schema/1/dc-schema">Rostock, Univ., Fak. für Informatik und Elektrotechnik, Diss., 2014</dc:description>
  <dc:subject xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:srw_dc="info:srw/schema/1/dc-schema">621.381531</dc:subject>
  <dc:subject xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:srw_dc="info:srw/schema/1/dc-schema">621.3</dc:subject>
  <dc:subject xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:srw_dc="info:srw/schema/1/dc-schema">ZN 4120</dc:subject>
  <dc:subject xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:srw_dc="info:srw/schema/1/dc-schema">53.53</dc:subject>
  <dc:subject xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:srw_dc="info:srw/schema/1/dc-schema">52.78</dc:subject>
  <dc:identifier xmlns:dc="http://purl.org/dc/elements/1.1/">http://rosdok.uni-rostock.de/resolve?urn=urn:nbn:de:gbv:28-diss2014-0194-8</dc:identifier>
  <dc:identifier xmlns:dc="http://purl.org/dc/elements/1.1/">http://rosdok.uni-rostock.de/resolve?urn=urn:nbn:de:gbv:28-diss2014-0194-8&amp;pdf</dc:identifier>
  <dc:identifier xmlns:dc="http://purl.org/dc/elements/1.1/">http://nbn-resolving.de/urn:nbn:de:gbv:28-diss2014-0194-8</dc:identifier>
  <dc:relation xmlns:dc="http://purl.org/dc/elements/1.1/">Simulation-based investigation of microwave treatments for printed circuit boards--(DE-627)804988676</dc:relation>
  <dc:identifier xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:srw_dc="info:srw/schema/1/dc-schema">urn:nbn:de:gbv:28-diss2014-0194-8</dc:identifier>
  <dc:identifier xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:srw_dc="info:srw/schema/1/dc-schema">oclc: 935771564</dc:identifier>
  <dc:identifier xmlns:dc="http://purl.org/dc/elements/1.1/">ppn:
				(DE-627)812371984</dc:identifier>
</oai_dc:dc>
